►Know-how
The Nano-Rennes platform produces engravings on a whole range of materials, either by a wet or a dry way. Chemical treatments are carried out under a chemical hood. Dry etchings use reactive ion etching reactors (GIR, or even RIE) dedicated.
In a generic way, the platform masters the wet and / or dry engravings associated with:
- Materials of Si sector (Si, Si3N4, SiO2, Ge, SiGe, …)
- Materials of InP sector (InAs, InGaAs, InAlAs, InGaAsP, InAlGaAs)
- Polymeric (photoresist, BCB, …) and metallic (In, Au, Ti, Ge, …) materials
►Description of engraving equipment
Dry etching
RIE Microsys 400 Roth&Rau (IETR-GM)
Gas : SF6, O2
Dédicated to Si sector engraving
Specificities:
- Plate 3 inches max
- Secondary vacuum (10-5 mbar)
- Interferometric control
RIE Alcatel 300 (FOTON-INSA)
Gas : CH4, H2, Ar, O2
Deticated to the InP sector engraving
Specificities:
- Plate 2 inches
- Secondary vacuum (10-7 mbar)
- Interferometric control
RIE Plassys MG100 (FOTON-INSA)
Gas : SF6, O2
Dedicated to the etching of polymers and passivation layers
Specificities:
- Plates 2 inches
- Secondary vacuum (10-6 mbar)
- Interferometric control
Deep RIE CORIAL (IETR-GM)
Gas : O2, SF6
Specificities :
- Plates 2 and 3 inches
- Secondary vacuum(10-7 mbar)
- Interferometric control
Plasmafab ETA Electrotech delacquer (FOTON-INSA)
Gas : O2
Resin remover
Specificities :
- Primary vacuum (10-3 mbar)
Wet etching
Chemical hood (FOTON-INSA and IETR-GM)
Chemical storage cabinet (FOTON-INSA and IETR-GM)
►Examples of achievements
