►Know-how
The Nano-Rennes platform is equipped with a set of lithography aligners, allowing it to provide standard resin patterns of micron (1 μm), sub-micron (0.7 μm) or even nanometric (50 nm) dimension. on emerging lithography processes. To these aligners are added several stations of resin coating and heat treatment. All of these workstations are located in class 100 environments.
Three types of aligners equip the platform:
- UV (UV4 365-435 nm) photolithography : minimal dimension 1 µm
- Deep-UV photolithography (UV 3 248 nm) : minimal dimension 0.7 µm
- Nano-print lithography : minimum dimension 50 nm
►Description of lithography equipment
UV aligners
Suss Microtec MJB4 (UV4) aligner and nano-imprint (FOTON-INSA)
- Sample 1/4 from 2″ to 4″
- Support for 3″ and 4″ mask
- Three lithography modes (proximity, contact, vacuum chamber)
- Alignment resolution ± 1 µm
- Maximum resolution ± 0.7 µm
Specificity : a nano-printing module, for surfaces limited to cm², with a maximum resolution of 50 nm.
Suss Microtec MJB4 (UV4) aligner and nano-imprint (FOTON-INSA)
- Sample 1/4 from 2″ to 4″
- Support for 3″ and 4″ mask
- Three lithography modes (proximity, contact, vacuum chamber)
- Alignment resolution ± 1 µm
- Maximum resolution ± 0.7 µm
Specificity : A nano-printing module, for surfaces limited to cm², with a maximum resolution of 50 nm.
Electronic lithography
Miscellanous
4 Suss Microtec type RC8 resiners (FOTON-INSA and IETR-GM)
- Sample 1/4 from 2″ to 2″
- 1 Gyrset hood resiner
- Several resins (from 200 nm to 4-5 µm thick, BCB, PMMA, ..)
4 optical microscopes (FOTON-INSA and IETR-GM)
- Magnification ×50 to ×200
- UV filter, camera
Masks design (IETR-GM and FOTON-INSA)
- Cadence
- CleWin