►Know-how
The Nano-Rennes platform is equipped with a set of equipment dedicated to the deposition of thin, metallic and dielectric layers.
Applications:
- Ohmic contacts (n and p) (generic for InP, Si and GaP)
- Electrical passivation
- Sacrificial or masking layer (RIE)
- Low temperature technology.
►Description of deposit equipment
Metal deposit
3 electrons gun evaporators (FOTON-INSA, IETR-GM)
Temescal : Au, Ti, Pt, Ge, Ni (10 plates 2 inches , ..)
2 Alliance concept : Al, Cr, Au, Pt, Ti, Ni, W, Ge, Cu, … (< 4 inches, lift-off process)
Specificities :
- 2 inches plates
- Thickness control
- Secondary vacuum (10-7 mbar)
Semiconductors
3 RF cathode sprayers
- Leybold (aSi, aSiN)
- Alcatel (aSi, ZnS, Ge, special alloys)
- Ranex (AlN)
Deposit in liquid form
Organic deposit
1 multi-crucible heat exchanger in gloves box (IETR-GM)
In-house developed reactor
Specificities :
- 2 inches
- Secondary vacuum (10-7 mbar)