►Know-how
The Nano-Rennes platform is equipped with tools to ensure the formatting of devices, or their micro-wiring.
►Description of packaging equipment
Mechanical polishing Buehler (FOTON-INSA)
- Thinning of any type of substrate (Si, GaAs, InP, …) according to the abrasive used
- Susbtract 2 inches max
- Thinning with a resolution of 10 μm
- Measurement of the removed thickness
Karl Suss chip Cleaver (FOTON-INSA)
- Starters of cleaving by diamond dots
- Max dimension of 2 inch plates
- Accuracy on displacement of 10 μm
- Adjustable applied force
Micro cable-making (Wedge bonding) Kulicke and Soffa 4123 (FOTON-INSA)
- Ultrasonic welding of gold or aluminum wire on metal pad
- Au and Al wires 25 μm in diameter
- Heating support (100-400°C)
- Manual or semi-automatic operation
- Binocular
►Examples of achievements
Direct component report or CMS
Micro-wiring of components
CMP chemico mechanical polishing
